Send us Feedback

Benchmark Electronics (BHE)
Analysis
SUMMARY
BULLS
BEARS
TOPICS
Data
DATA CENTRAL
STOCK CHART
Financials
SEC FILINGS
BALANCE
INCOME
CASH FLOW

BHE » Topics » Manufacturing Technologies.

These excerpts taken from the BHE 10-K filed Feb 28, 2008.
Manufacturing Technologies. We offer our customers expertise in a wide variety of traditional and advanced manufacturing technologies. Our technical expertise supports standard printed circuit board assembly as well as complex products that require advanced engineering skills and equipment.

 

We also provide our customers with a comprehensive set of manufacturing technologies and solutions which include:

 

·                  Pin Thru Hole,

·                  Surface Mount Technology,

·                  Fine Pitch,

·                  Ball Grid Array,

·                  Flip Chip,

·                  Chip On Board/Wirebonding,

·                  In-Circuit Test,

·                  Board Level Functional Test, and

·                  Stress Testing.

 

8


 

We also provide specialized solutions in support of Optical and Wireless components and systems which include:

 

·                  Adhesives,

·                  Conformal Coating,

·                  Laser Welding,

·                  Hybrid Optical/Electrical Printed Circuit Board Assembly and Test, and

·                  Sub-micron Alignment of Optical Sub-Assemblies.

 

Through our Component Engineering Services, we are helping our customers deal with the changing international environmental regulations such as the European Union (EU) Restriction of the Use of Hazardous Substances in electrical and electronic Equipment (RoHS). Manufacturing sites in the Americas, Asia and European regions are certified in both water soluble and no-clean processes and are currently producing products that are RoHS compliant.

 

Manufacturing
Technologies. We offer our customers
expertise in a wide variety of traditional and advanced manufacturing
technologies. Our technical expertise supports standard printed circuit board
assembly as well as complex products that require advanced engineering skills
and equipment.



 



We also provide our customers with a comprehensive set
of manufacturing technologies and solutions which include:



 



·                  Pin Thru Hole,



·                  Surface
Mount Technology,



·                  Fine
Pitch,



·                  Ball
Grid Array,



·                  Flip
Chip,



·                  Chip
On Board/Wirebonding,



·                  In-Circuit
Test,



·                  Board
Level Functional Test, and



·                  Stress
Testing.



 



8















 



We also provide specialized solutions in support of
Optical and Wireless components and systems which include:



 



·                  Adhesives,



·                  Conformal
Coating,



·                  Laser
Welding,



·                  Hybrid
Optical/Electrical Printed Circuit Board Assembly and Test, and



·                  Sub-micron
Alignment of Optical Sub-Assemblies.



 



Through our
Component Engineering Services, we are helping our customers deal with the
changing international environmental regulations such as the European Union
(EU) Restriction of the Use of Hazardous Substances in electrical and
electronic Equipment (RoHS). Manufacturing sites in the Americas, Asia and
European regions are certified in both water soluble and no-clean processes and
are currently producing products that are RoHS compliant.



 



EXCERPTS ON THIS PAGE:

10-K (2 sections)
Feb 28, 2008

RELATED TOPICS for BHE:

Wikinvest © 2006, 2007, 2008, 2009, 2010, 2011, 2012. Use of this site is subject to express Terms of Service, Privacy Policy, and Disclaimer. By continuing past this page, you agree to abide by these terms. Any information provided by Wikinvest, including but not limited to company data, competitors, business analysis, market share, sales revenues and other operating metrics, earnings call analysis, conference call transcripts, industry information, or price targets should not be construed as research, trading tips or recommendations, or investment advice and is provided with no warrants as to its accuracy. Stock market data, including US and International equity symbols, stock quotes, share prices, earnings ratios, and other fundamental data is provided by data partners. Stock market quotes delayed at least 15 minutes for NASDAQ, 20 mins for NYSE and AMEX. Market data by Xignite. See data providers for more details. Company names, products, services and branding cited herein may be trademarks or registered trademarks of their respective owners. The use of trademarks or service marks of another is not a representation that the other is affiliated with, sponsors, is sponsored by, endorses, or is endorsed by Wikinvest.
Powered by MediaWiki