This excerpt taken from the CAMD 10-Q filed Feb 9, 2007.
16. Subsequent Event
On January 24, 2007, we entered into agreement with SPEL Semiconductor Limited (SPEL), who currently provides packaging and testing of TDFN semiconductor devices for us, for SPEL to expand these services to include UDFN and uUDFN packages. As part of the agreement, we will purchase and consign to SPEL approximately $2.2 million of equipment in exchange for discounted pricing on SPEL packaging services. Once SPEL has provided us with cumulative discounts equal to the cost of the consigned equipment, title to the equipment will be transferred to SPEL.
In this discussion, CMD, the Company, we, us and our refer to California Micro Devices Corporation. All trademarks appearing in this discussion are the property of their respective owners. This discussion should be read in conjunction with other financial information and financial statements and related notes contained elsewhere in this report.
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