LIVERMORE, CA -- (Marketwire) -- 06/06/12 -- FormFactor, Inc. (NASDAQ: FORM) today announced general availability of TrueScale Matrix probe cards for 200mm and 300mm Full Wafer Contact system-on-chip, or SOC, test applications. TrueScale Matrix applies the company's proven, high-parallel capabilities of SmartMatrix and TouchMatrix memory product solutions to SOC test.
The Matrix architecture provides consistent contact performance across the full wafer, over the life of the probe card to help IC makers lower their overall test costs. The TrueScale Matrix solution enables manufacturers of embedded memory and automotive applications to reduce the number of touchdowns per wafer, while achieving stable test over a wide temperature range. New high-parallel SOC test systems can leverage the TrueScale Matrix architecture for DUT array optimization to achieve 256 DUTs in parallel capability today, with extendibility to 512 DUTs or higher.
"Rapidly increasing customer adoption of our TrueScale Matrix solution for SOC applications reinforces the benefits of stable contact, high parallelism, and improved yield demonstrated by the Matrix platform for DRAM and FLASH," said Glenn Farris, vice president of Marketing at FormFactor. "We are investing in our Matrix architecture in close partnership with our customers to enable long term wafer test roadmaps."
The TrueScale Matrix platform leverages the company's MicroSpring® 3D MEMS contact technology to deliver probing performance which increases wafer test cell utilization and parallelism while improving test yields, enabling customers to lower test costs on SOC, DRAM, and FLASH devices. The most recent TrueScale Matrix product shipment was made to a leading automotive device supplier for highly parallel microcontroller test. FormFactor's customers have installed over 1200 units of the Matrix probe solutions, making this the fastest ramping platform in company history.
Founded in 1993, FormFactor, Inc. (NASDAQ: FORM) is a leader in advanced wafer probe cards, which are used by semiconductor manufacturers to electrically test ICs. The company's wafer sort, burn-in and device performance testing products move IC testing upstream from post-packaging to the wafer level, enabling semiconductor manufacturers to lower their overall production costs, improve yields, and bring next-generation devices to market. FormFactor is headquartered in Livermore, California with operations in Europe, Asia and North America. For more information, visit the company's web site at www.formfactor.com.
Statements in this press release that are not strictly historical in nature are forward-looking statements within the meaning of the federal securities laws, including statements regarding business momentum, demand for our products and future growth. These forward-looking statements are based on current information and expectations that are inherently subject to change and involve a number of risks and uncertainties. Actual events or results might differ materially from those in any forward-looking statement due to various factors, including, but not limited to: changes in the market environment, the company's ability to leverage its SmartMatrix and TouchMatrix product architecture for System on Chip, or SOC, and Embedded Memory wafer probe card applications; the ability of the company to realize adoption of its TrueScale Matrix solution; the capability of the Matrix architecture products to deliver contact performance across the full wafer, over the life of the probe card and to deliver stable contact, high parallelism, and improved yield; the ability of IC makers to lower their overall test costs using the Matrix architecture products; and the company's ability to work with its customers and timely deliver new products that meet its customer's testing requirements and lower their overall cost of test. Additional information concerning factors that could cause actual events or results to differ materially from those in any forward-looking statement is contained in the company's Form 10-K for the fiscal year ended December 31, 2011, as filed with the Securities and Exchange Commission ("SEC"), and subsequent SEC filings. Copies of the company's SEC filings are available at http://investors.formfactor.com/edgar.cfm. The company assumes no obligation to update the information in this press release, to revise any forward-looking statements or to update the reasons actual results could differ materially from those anticipated in forward-looking statements.
FormFactor, TrueScale Matrix, TouchMatrix, SmartMatrix and MicroSpring are trademarks or registered trademarks of FormFactor, Inc.