IFX » Topics » Back-end

This excerpt taken from the IFX 20-F filed Dec 8, 2009.
Back-end
 
We have a number of back-end facilities, located primarily in Asia. We also use assembly and test subcontractors to provide us with flexibility in meeting demand, as well as managing investment expenditures. For assembly services, we have further intensified our partnership with AMKOR Technology on leadless and flip-chip technologies.
 
We and Advanced Semiconductor Engineering Inc., (“ASE”) announced in November 2007 a partnership to introduce semiconductor packages with a higher integration level of package size, the Wafer-Level Ball Grid Array technology, which achieves a 30 percent reduction of dimension compared to conventional (lead-frame laminate) packages. This partnership unites the technology developed by us with the packaging know-how of ASE in a license model.
 
In August 2008, we, STMicroelectronics and STATS ChipPAC announced an agreement to jointly develop the next-generation of eWLB technology, based on our first-generation technology, for use in manufacturing future-generation semiconductor packages. This will build on our existing eWLB packaging technology, which we have licensed to our development partners. The R&D effort, for which the resulting IP will be jointly owned by the three companies, focuses on using both sides of a reconstituted wafer to provide solutions for semiconductor devices with a higher integration level and a greater number of contact elements.


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Back-end
 
Infineon has a number of back-end facilities, located primarily in Asia. Infineon also uses assembly and test subcontractors to provide Infineon with flexibility in meeting demand, as well as managing investment expenditures. For assembly services, Infineon has further intensified its partnership with AMKOR Technology on leadless and flip-chip technologies.
 
Infineon and Advanced Semiconductor Engineering Inc., (“ASE”) announced in November 2007 a partnership to introduce semiconductor packages with a higher integration level of package size, the Wafer-Level Ball Grid Array technology, which achieves a 30 percent reduction of dimension compared to conventional (lead-frame laminate) packages. This partnership unites the technology developed by Infineon with the packaging know-how of ASE in a license model.
 
In August 2008, Infineon, STMicroelectronics and STATS ChipPAC announced an agreement to jointly develop the next-generation of eWLB technology, based on Infineon’s first-generation technology, for use in manufacturing future-generation semiconductor packages. This will build on Infineon’s existing eWLB packaging technology, which Infineon has licensed to its development partners. The R&D effort, for which the resulting IP will be jointly owned by the three companies, focuses on using both sides of a reconstituted wafer to provide solutions for semiconductor devices with a higher integration level and a greater number of contact elements.
 
This excerpt taken from the IFX 6-K filed Jul 16, 2009.
Back-end
 
Infineon has a number of back-end facilities, located primarily in Asia. Infineon also uses assembly and test subcontractors to provide Infineon with flexibility in meeting demand, as well as managing investment expenditures. For assembly services, Infineon has further intensified its partnership with AMKOR Technology on leadless and flip-chip technologies.
 
Infineon and Advanced Semiconductor Engineering Inc., (“ASE”) announced in November 2007 a partnership to introduce semiconductor packages with a higher integration level of package size, the Wafer-Level Ball Grid Array technology, which achieves a 30 percent reduction of dimension compared to conventional (lead-frame laminate) packages. This partnership unites the technology developed by Infineon with the packaging know-how of ASE in a license model.
 
In August 2008, Infineon, STMicroelectronics and STATS ChipPAC announced an agreement to jointly develop the next-generation of eWLB technology, based on Infineon’s first-generation technology, for use in manufacturing future-generation semiconductor packages. This will build on Infineon’s existing eWLB packaging technology, which Infineon has licensed to its development partners. The R&D effort, for which the resulting IP will be jointly owned by the three companies, focuses on using both sides of a reconstituted wafer to provide solutions for semiconductor devices with a higher integration level and a greater number of contact elements.
 
This excerpt taken from the IFX 20-F filed Dec 29, 2008.
Back-end
 
As part of the repositioning of Qimonda, it decided to ramp down manufacturing at its back-end facility at Dresden, Germany by March 2009. Qimonda has back-end operations at Porto, Portugal and Johor, Malaysia. Qimonda has transferred its module manufacturing from its back-end site at Malacca, Malaysia to Johor. The facility in Malacca has been sold and transferred to Infineon in November 2008. In addition, Qimonda sources back-end capacities from its joint venture Qimonda Suzhou, China and uses third party subcontractors for part of the back-end volumes to balance the load in its own fabs. Package development was mainly done at Dresden and will be transferred to Porto. The back-end sites in Porto and Suzhou focus on volume manufacturing of components and the site at Johor focuses on the manufacturing of DRAM modules.
 
This excerpt taken from the IFX 20-F filed Dec 7, 2007.
Back-end
 
Qimonda has its own back-end operations at its lead fab in Dresden as well as in Porto, Portugal and Malacca, Malaysia. In addition, Qimonda sources back-end capacities from its joint venture Qimonda Suzhou, China and uses third party subcontractors for part of the back-end volumes to balance the load in its own fabs. Package development is mainly done at Dresden, whereas the back-end sites in Porto, Malacca and Suzhou focus on volume manufacturing of components as well as DRAM modules. In the 2007 fiscal year, Qimonda and EEMS Italia S.p.A. entered into a partnership dedicated to the assembly and testing of memories. EEMS will manufacture components in a dedicated manufacturing facility in Suzhou, China, that is currently under construction and scheduled to start operations early in the 2008 calendar year. In addition, Qimonda announced plans to construct a new facility for module manufacturing in Johor, Malaysia in which it expects to invest €150 million over the next five years.
 
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