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This excerpt taken from the IFX 20-F filed Dec 8, 2009. Back-end
We have a number of back-end facilities, located primarily in
Asia. We also use assembly and test subcontractors to provide us
with flexibility in meeting demand, as well as managing
investment expenditures. For assembly services, we have further
intensified our partnership with AMKOR Technology on leadless
and flip-chip technologies.
We and Advanced Semiconductor Engineering Inc.,
(“ASE”) announced in November 2007 a partnership to
introduce semiconductor packages with a higher integration level
of package size, the Wafer-Level Ball Grid Array
technology, which achieves a 30 percent reduction of
dimension compared to conventional (lead-frame laminate)
packages. This partnership unites the technology developed by us
with the packaging know-how of ASE in a license model.
In August 2008, we, STMicroelectronics and STATS ChipPAC
announced an agreement to jointly develop the next-generation of
eWLB technology, based on our first-generation technology, for
use in manufacturing future-generation semiconductor packages.
This will build on our existing eWLB packaging technology, which
we have licensed to our development partners. The R&D
effort, for which the resulting IP will be jointly owned by the
three companies, focuses on using both sides of a reconstituted
wafer to provide solutions for semiconductor devices with a
higher integration level and a greater number of contact
elements.
Table of Contents
This excerpt taken from the IFX 6-K filed Jul 16, 2009. Back-end
Infineon has a number of back-end facilities, located primarily
in Asia. Infineon also uses assembly and test subcontractors to
provide Infineon with flexibility in meeting demand, as well as
managing investment expenditures. For assembly services,
Infineon has further intensified its partnership with AMKOR
Technology on leadless and flip-chip technologies.
Infineon and Advanced Semiconductor Engineering Inc.,
(“ASE”) announced in November 2007 a
partnership to introduce semiconductor packages with a higher
integration level of package size, the Wafer-Level Ball
Grid Array technology, which achieves a 30 percent
reduction of dimension compared to conventional (lead-frame
laminate) packages. This partnership unites the technology
developed by Infineon with the packaging know-how of ASE in a
license model.
In August 2008, Infineon, STMicroelectronics and STATS ChipPAC
announced an agreement to jointly develop the next-generation of
eWLB technology, based on Infineon’s first-generation
technology, for use in manufacturing future-generation
semiconductor packages. This will build on Infineon’s
existing eWLB packaging technology, which Infineon has licensed
to its development partners. The R&D effort, for which the
resulting IP will be jointly owned by the three companies,
focuses on using both sides of a reconstituted wafer to provide
solutions for semiconductor devices with a higher integration
level and a greater number of contact elements.
This excerpt taken from the IFX 6-K filed Jul 16, 2009. Back-end
Infineon has a number of back-end facilities, located primarily
in Asia. Infineon also uses assembly and test subcontractors to
provide Infineon with flexibility in meeting demand, as well as
managing investment expenditures. For assembly services,
Infineon has further intensified its partnership with AMKOR
Technology on leadless and flip-chip technologies.
Infineon and Advanced Semiconductor Engineering Inc.,
(“ASE”) announced in November 2007 a
partnership to introduce semiconductor packages with a higher
integration level of package size, the Wafer-Level Ball
Grid Array technology, which achieves a 30 percent
reduction of dimension compared to conventional (lead-frame
laminate) packages. This partnership unites the technology
developed by Infineon with the packaging know-how of ASE in a
license model.
In August 2008, Infineon, STMicroelectronics and STATS ChipPAC
announced an agreement to jointly develop the next-generation of
eWLB technology, based on Infineon’s first-generation
technology, for use in manufacturing future-generation
semiconductor packages. This will build on Infineon’s
existing eWLB packaging technology, which Infineon has licensed
to its development partners. The R&D effort, for which the
resulting IP will be jointly owned by the three companies,
focuses on using both sides of a reconstituted wafer to provide
solutions for semiconductor devices with a higher integration
level and a greater number of contact elements.
This excerpt taken from the IFX 20-F filed Dec 29, 2008. Back-end
As part of the repositioning of Qimonda, it decided to ramp down
manufacturing at its back-end facility at Dresden, Germany by
March 2009. Qimonda has back-end operations at Porto, Portugal
and Johor, Malaysia. Qimonda has transferred its module
manufacturing from its back-end site at Malacca, Malaysia to
Johor. The facility in Malacca has been sold and transferred to
Infineon in November 2008. In addition, Qimonda sources back-end
capacities from its joint venture Qimonda Suzhou, China and uses
third party subcontractors for part of the back-end volumes to
balance the load in its own fabs. Package development was mainly
done at Dresden and will be transferred to Porto. The back-end
sites in Porto and Suzhou focus on volume manufacturing of
components and the site at Johor focuses on the manufacturing of
DRAM modules.
This excerpt taken from the IFX 20-F filed Dec 7, 2007. Back-end
Qimonda has its own back-end operations at its lead fab in
Dresden as well as in Porto, Portugal and Malacca, Malaysia. In
addition, Qimonda sources back-end capacities from its joint
venture Qimonda Suzhou, China and uses third party
subcontractors for part of the back-end volumes to balance the
load in its own fabs. Package development is mainly done at
Dresden, whereas the back-end sites in Porto, Malacca and Suzhou
focus on volume manufacturing of components as well as DRAM
modules. In the 2007 fiscal year, Qimonda and EEMS Italia S.p.A.
entered into a partnership dedicated to the assembly and testing
of memories. EEMS will manufacture components in a dedicated
manufacturing facility in Suzhou, China, that is currently under
construction and scheduled to start operations early in the 2008
calendar year. In addition, Qimonda announced plans to construct
a new facility for module manufacturing in Johor, Malaysia in
which it expects to invest €150 million over the next
five years.
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