MRVL » Topics » The Opportunity for New Integrated Circuit Solutions

This excerpt taken from the MRVL 10-K filed Apr 14, 2005.

The Opportunity for New Integrated Circuit Solutions

        We believe the rapidly growing demand for products that enable the storage, transmission and management of large volumes of voice, video and data at high speeds is creating the need for a new generation of integrated circuit solutions:

    Disk drive read channel chips and SOC devices that are capable of handling increasingly higher data transmission rates with sophisticated error correction features, low power consumption and incorporation of a variety of interfaces;

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    Physical layer devices that are capable of supporting increasingly higher data transmission rates over existing media infrastructures;

    Switches that have the intelligence to process and provide routing management functions and carry information in multiple forms including voice, video and data;

    Wireless LAN chipsets that enable reliable, high-speed data transmission for wireless connectivity, as well as, very low power, highly integrated Wireless LAN chipsets for emerging consumer electronic devices;

    Power management solutions that are able to efficiently scale with the increasing electrical current required in today's electronic equipment while also driving extended battery life and enhanced thermal profile;

    System controllers that improve CPU subsystem performance, enabling the quick and efficient movement of data;

    WAN communication controllers that bridge the LAN with the Internet infrastructure; and

    Serial connectivity chips that connect disk drives with motherboards at increased data transfer rates using Serial ATA technology.

        Additionally, we believe that our high-performance analog, mixed-signal, digital signal processing and embedded microprocessor technology can also be leveraged into many other large volume and diverse markets that will have the added benefit of increasing our customer and market diversification.

        To keep the power consumption of these new solutions at acceptable levels, more efficient yet powerful signal processing algorithms, implemented in silicon, are required. These next-generation devices must also satisfy market demands associated with large production volumes, competitive pricing, high reliability and decreased size. To meet these demands, we also expect the trend to continue towards integrating into one chip various functions that are generally implemented in discrete integrated circuits. Integration reduces the overall number of components in a system, reducing overall system cost and power consumption. We believe the integration of high performance embedded microprocessors will be an important technology to enable such high levels of integration.

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