OPXT » Topics » Technology and Research and Development

These excerpts taken from the OPXT 10-K filed Jun 15, 2009.
Technology and Research and Development
 
We use our proprietary technology at many levels within our product development, ranging from the basic materials research that created the innovative materials we use in our lasers to the sophisticated component integration and optimization techniques we use to design our modules. We are committed to conducting fundamental research in laser and photonic integration technologies. In addition, we have a proven record of converting this research into commercial products. Our technology is protected by our strong patent portfolio and trade secrets developed in deployments with our extensive customer base. Our leading technologies start with our fundamental laser, modulation and photodetector technology and extend through design and assembly. In particular, the following technologies are central to our business:
 
Semiconductor Laser Design & Manufacturing.  We are a leading designer and manufacturer of lasers for high-speed fiber optic communications such as 10Gbps and 40Gbps. In the development and


6


Table of Contents

manufacturing of new lasers, we utilize accumulated knowledge in areas such as semiconductor growth, semiconductor materials systems, quantum well engineering, wavelength design, and high-frequency performance. This knowledge enables performance improvements such as miniaturization, wavelength control, wide temperature, and high-speed operation, and provides us with a time and knowledge advantage over companies that source their 10Gbps and 40Gbps lasers from other companies.
 
Optical Semiconductor Materials.  Central to our laser design and manufacturing is our experience and research in materials, one of the most challenging aspects of optical communications technology and a source of competitive advantage. Our advances in optical semiconductor materials have enabled us to develop new lasers that are more compact, offer greater control of the light emitted and utilize less power to operate. For example, our innovations in the use of aluminum in semiconductor lasers are utilized in several of our new lasers including our uncooled DFB laser and an EA-DFB laser, which integrates a modulator with the DFB laser on the same chip. The use of aluminum gives these lasers increased temperature tolerance, improved efficiency, faster response time and greater wavelength stability, all while achieving or exceeding industry reliability requirements. Our research continues on new materials systems for use in developing new laser structures that provide further improvements in laser operating temperature and efficiency. We also have developed novel techniques for a InAlA materials system that is used in the construction of high-performance avalanche photodiodes and which are central to performing the receive function.
 
Subassembly Design.  Laser diodes and photodetectors are particularly sensitive to external forces, fields and chemical environments, so they are typically housed in a hermetically sealed package. These laser diodes and photodetectors are placed upon special ceramic circuit boards and packaged into a mechanical housing with certain electronics into transmit or receive optical subassemblies, or TOSA and ROSA, respectively. We have experts dedicated to TOSA and ROSA design with fundamental knowledge in laser physics, high-frequency design and mechanical design who have been awarded numerous patents. We are a founding member of the XMD and XLMD MSA’s which create a platform of miniature, high-performance TOSAs and ROSAs for 10Gbps and 40Gbps, respectively, that can be used across multiple products and sold to external customers.
 
Analog Integrated Circuit and Radio Frequency Design.  We deliver advanced 40Gbps modulation scheme solutions, which are designed to be very close to the theoretical limits of achievable performance, by leveraging our analog IC and radio frequency design expertise. We internally develop both Silicon Germanium integrated circuits (developing what we believe to be the industry’s first finite impulse response adaptive equalizer integrated circuit operating at 40Gbps line speed) and monolithic microwave integrated circuits for modulator driver amplifier applications. This analog electronics expertise captured in our integrated circuits provides our 40Gbps transponders with improved performance and fast time-to-market. In addition, we have pioneered the development of multi-chip module packaging, radio frequency techniques for 40Gbps applications and packaging and interconnect design at 40Gbps.
 
Analog Optical Design.  Our analog optical design expertise enables us to deliver consistent product performance in a manufacturable design. In addition to delivering advanced performance for PSBT and DPSK 40Gbps transponders, we have also pioneered the development of carrier-class PMD compensation.
 
Digital Logic Design.  We internally developed the digital logic for our 40Gbps products, including OC-768 and OTU3 framers, integrated PRBS tester, precoder logic and enhanced FEC. We believe these designs provide us with a competitive advantage, as we believe no other single digital IC solution is commercially available with all of the capabilities we require. Our ability to internally develop this digital logic provides us with a cost advantage as volume scales and allows us to maintain a level of flexibility by controlling our ability to add new features and functionality.
 
Module Design.  Transceiver modules integrate the TOSA, ROSA, integrated circuits and other components into compact packages specified by various MSAs. We possess key technology in the form of high-speed circuit design to allow for error-free receiving, processing and transmitting of information, exceptional mechanical design to allow for higher tolerance of electrical and mechanical shock, and excellent thermal design to transfer heat away from key components and the module. We also have expertise in the design and manufacture of optical modules for long-distance transmission including tunable laser modules. Long-distance transmission modules require special manipulation of the optical signal to insure that error-free transmission is achieved over tens to hundreds of kilometers of optical fiber.


7


Table of Contents

Modulation Techniques.  With the acquisition of StrataLight, we now posses expertise and know-how in using modem modulation schemes for optical transmission. These include mastering of PMDC (polarization mode dispersion compensation), continuously optimized NRZ-DPSK, RZ-DQPSK and coherent technologies. As an example of our leadership, we maintain a database of carrier fiber characteristics and deployed infrastructure that allows us to accurately model our PMDC solutions based upon real-world impairments.
 
System-Level Software.  At the system level, we offer a web-based graphical user interface that provides fault, configuration, accounting, performance and security, or FCAPS, capabilities within a self-contained, network-managed subsystem. Our software enables fast and simple integration into our OEM customers’ management systems via XML or SNMP management interfaces. By combining our standards-compliant software interfaces with our 40Gbps subsystem, OEM customers are not required to independently develop hardware to integrate our 40Gbps subsystems into their existing DWDM systems.
 
Our research and development plans are driven by customer input obtained by our sales and marketing teams and in our participation in various MSAs, and by our long-term technology and product strategies. We review research and development priorities on a regular basis and advise key customers and Tier 1 carriers of our research and development progress to achieve better alignment in our product and technology planning. For new components and more complex modules, research and development is conducted in close collaboration with our manufacturing operations to shorten the time-to-market and optimize the manufacturing process. We generally perform product commercialization activities ourselves and utilize our Hitachi relationship to jointly develop or fund more fundamental optical technology such as new laser designs and materials systems.
 
Technology
and Research and Development



 



We use our proprietary technology at many levels within our
product development, ranging from the basic materials research
that created the innovative materials we use in our lasers to
the sophisticated component integration and optimization
techniques we use to design our modules. We are committed to
conducting fundamental research in laser and photonic
integration technologies. In addition, we have a proven record
of converting this research into commercial products. Our
technology is protected by our strong patent portfolio and trade
secrets developed in deployments with our extensive customer
base. Our leading technologies start with our fundamental laser,
modulation and photodetector technology and extend through
design and assembly. In particular, the following technologies
are central to our business:


 



Semiconductor Laser Design &
Manufacturing.
  We are a leading designer and
manufacturer of lasers for high-speed fiber optic communications
such as 10Gbps and 40Gbps. In the development and





6





Table of Contents






manufacturing of new lasers, we utilize accumulated knowledge in
areas such as semiconductor growth, semiconductor materials
systems, quantum well engineering, wavelength design, and
high-frequency performance. This knowledge enables performance
improvements such as miniaturization, wavelength control, wide
temperature, and high-speed operation, and provides us with a
time and knowledge advantage over companies that source their
10Gbps and 40Gbps lasers from other companies.


 



Optical Semiconductor Materials.  Central to
our laser design and manufacturing is our experience and
research in materials, one of the most challenging aspects of
optical communications technology and a source of competitive
advantage. Our advances in optical semiconductor materials have
enabled us to develop new lasers that are more compact, offer
greater control of the light emitted and utilize less power to
operate. For example, our innovations in the use of aluminum in
semiconductor lasers are utilized in several of our new lasers
including our uncooled DFB laser and an EA-DFB laser, which
integrates a modulator with the DFB laser on the same chip. The
use of aluminum gives these lasers increased temperature
tolerance, improved efficiency, faster response time and greater
wavelength stability, all while achieving or exceeding industry
reliability requirements. Our research continues on new
materials systems for use in developing new laser structures
that provide further improvements in laser operating temperature
and efficiency. We also have developed novel techniques for a
InAlA materials system that is used in the construction of
high-performance avalanche photodiodes and which are central to
performing the receive function.


 



Subassembly Design.  Laser diodes and
photodetectors are particularly sensitive to external forces,
fields and chemical environments, so they are typically housed
in a hermetically sealed package. These laser diodes and
photodetectors are placed upon special ceramic circuit boards
and packaged into a mechanical housing with certain electronics
into transmit or receive optical subassemblies, or TOSA and
ROSA, respectively. We have experts dedicated to TOSA and ROSA
design with fundamental knowledge in laser physics,
high-frequency design and mechanical design who have been
awarded numerous patents. We are a founding member of the XMD
and XLMD MSA’s which create a platform of miniature,
high-performance TOSAs and ROSAs for 10Gbps and 40Gbps,
respectively, that can be used across multiple products and sold
to external customers.


 



Analog Integrated Circuit and Radio Frequency
Design.
  We deliver advanced 40Gbps modulation
scheme solutions, which are designed to be very close to the
theoretical limits of achievable performance, by leveraging our
analog IC and radio frequency design expertise. We internally
develop both Silicon Germanium integrated circuits (developing
what we believe to be the industry’s first finite impulse
response adaptive equalizer integrated circuit operating at
40Gbps line speed) and monolithic microwave integrated circuits
for modulator driver amplifier applications. This analog
electronics expertise captured in our integrated circuits
provides our 40Gbps transponders with improved performance and
fast
time-to-market.
In addition, we have pioneered the development of multi-chip
module packaging, radio frequency techniques for 40Gbps
applications and packaging and interconnect design at 40Gbps.


 



Analog Optical Design.  Our analog optical
design expertise enables us to deliver consistent product
performance in a manufacturable design. In addition to
delivering advanced performance for PSBT and DPSK 40Gbps
transponders, we have also pioneered the development of
carrier-class PMD compensation.


 



Digital Logic Design.  We internally developed
the digital logic for our 40Gbps products, including
OC-768 and
OTU3 framers, integrated PRBS tester, precoder logic and
enhanced FEC. We believe these designs provide us with a
competitive advantage, as we believe no other single digital IC
solution is commercially available with all of the capabilities
we require. Our ability to internally develop this digital logic
provides us with a cost advantage as volume scales and allows us
to maintain a level of flexibility by controlling our ability to
add new features and functionality.


 



Module Design.  Transceiver modules integrate
the TOSA, ROSA, integrated circuits and other components into
compact packages specified by various MSAs. We possess key
technology in the form of high-speed circuit design to allow for
error-free receiving, processing and transmitting of
information, exceptional mechanical design to allow for higher
tolerance of electrical and mechanical shock, and excellent
thermal design to transfer heat away from key components and the
module. We also have expertise in the design and manufacture of
optical modules for long-distance transmission including tunable
laser modules. Long-distance transmission modules require
special manipulation of the optical signal to insure that
error-free transmission is achieved over tens to hundreds of
kilometers of optical fiber.





7





Table of Contents






Modulation Techniques.  With the acquisition of
StrataLight, we now posses expertise and know-how in using modem
modulation schemes for optical transmission. These include
mastering of PMDC (polarization mode dispersion compensation),
continuously optimized NRZ-DPSK, RZ-DQPSK and coherent
technologies. As an example of our leadership, we maintain a
database of carrier fiber characteristics and deployed
infrastructure that allows us to accurately model our PMDC
solutions based upon real-world impairments.


 



System-Level Software.  At the system
level, we offer a web-based graphical user interface that
provides fault, configuration, accounting, performance and
security, or FCAPS, capabilities within a self-contained,
network-managed subsystem. Our software enables fast and simple
integration into our OEM customers’ management systems via
XML or SNMP management interfaces. By combining our
standards-compliant software interfaces with our 40Gbps
subsystem, OEM customers are not required to independently
develop hardware to integrate our 40Gbps subsystems into their
existing DWDM systems.


 



Our research and development plans are driven by customer input
obtained by our sales and marketing teams and in our
participation in various MSAs, and by our long-term technology
and product strategies. We review research and development
priorities on a regular basis and advise key customers and
Tier 1 carriers of our research and development progress to
achieve better alignment in our product and technology planning.
For new components and more complex modules, research and
development is conducted in close collaboration with our
manufacturing operations to shorten the
time-to-market
and optimize the manufacturing process. We generally perform
product commercialization activities ourselves and utilize our
Hitachi relationship to jointly develop or fund more fundamental
optical technology such as new laser designs and materials
systems.


 




These excerpts taken from the OPXT 10-K filed Jun 16, 2008.
Technology and Research and Development
 
We utilize our proprietary technology at many levels within our product development, ranging from the basic materials research that created the innovative materials we use in our lasers to the sophisticated component integration and optimization techniques we use to design our modules. We are committed to conducting fundamental research in laser technologies. In addition, we have a proven record of successfully productizing this research. Our technology is protected by our strong patent portfolio and trade secrets developed in deployments with our extensive customer base. Our leading technologies start with our fundamental laser technology and extend through design and assembly. In particular, the following technologies are central to our business:
 
Semiconductor Laser Design & Manufacturing.  We are a leading manufacturer and designer of lasers for high speed fiber optic communications such as 10Gbps and 40Gbps. In the development and manufacturing of new lasers, we utilize accumulated knowledge in areas such as semiconductor growth, semiconductor materials systems, quantum well engineering, design for very precise wavelengths, and high frequency performance. This knowledge enables performance improvements such as miniaturization, wavelength control, wide temperature, and high speed operation, and provides us with a time and knowledge advantage over companies that source their 10Gbps and 40Gbps lasers from other companies.
 
Optical Semiconductor Materials.  Central to our laser design and manufacturing is our experience and research in materials, one of the most challenging aspects of optical communications technology and a source of competitive advantage. Our advances in optical semiconductor materials have enabled us to develop new lasers that are more compact, offer greater control of the light emitted and utilize less power to operate. For example, our innovations in the use of aluminum in semiconductor lasers are utilized in several of our new lasers including our uncooled DFB laser and an EA-DFB laser which integrates a modulator with the DFB laser on the same chip. The use of aluminum gives these lasers increased temperature tolerance, improved efficiency, faster response time and greater wavelength stability, all while achieving or exceeding industry reliability requirements. Our research continues on new materials systems for use in developing new laser


6


Table of Contents

structures that provide further improvements in laser operating temperature and efficiency. We also have developed novel techniques for the use of the materials system InAlAs in the construction of high performance avalanche photodiodes which is central to performing the receive function.
 
Subassembly Design.  Laser diodes and photodetectors are particularly sensitive to external forces, fields and chemical environments, so they are typically housed in a hermetically sealed package. These laser diodes and photodetectors are placed upon special ceramic circuit boards and are packaged into a mechanical housing with certain electronics into transmit or receive optical subassemblies, or TOSA and ROSA, respectively. We have experts dedicated to TOSA and ROSA design with fundamental knowledge in laser physics, high frequency design and mechanical design who have garnered numerous patents. We are a founding member of the XMD and XLMD MSA’s which create a platform of miniature, high performance TOSAs and ROSAs for 10Gbps and 40Gbps that can be used across multiple products and sold to external customers.
 
Module Design.  Transceiver modules integrate the TOSA, ROSA, integrated circuits and other components into compact packages specified by various MSAs. We possess key technology in the form of high speed circuit design skills for error-free processing, transmitting, receiving and outputting of information, exceptional mechanical design to allow for higher tolerance of electrical and mechanical shock, and excellent thermal design to transfer heat away from key components and out of the module. We also have expertise in the design and manufacture of optical modules for long distance transmission including tunable laser modules. Long-distance transmission modules require special manipulation of the optical signal to insure that error free transmission is achieved over tens to hundreds of kilometers of optical fiber.
 
Our research and development plans are driven by customer input obtained by our sales and marketing teams and in our participation in various MSAs, and by our long-term technology and product strategies. We review research and development priorities on a regular basis and advise key customers of our progress to achieve better alignment in our product and technology planning. For new components and more complex modules, research and development is conducted in close collaboration with our manufacturing operations to shorten the time to market and optimize the manufacturing process. We generally perform product commercialization activities ourselves and utilize our Hitachi relationship to jointly develop or fund more fundamental optical technology such as new laser designs and materials systems.
 
Technology
and Research and Development



 



We utilize our proprietary technology at many levels within our
product development, ranging from the basic materials research
that created the innovative materials we use in our lasers to
the sophisticated component integration and optimization
techniques we use to design our modules. We are committed to
conducting fundamental research in laser technologies. In
addition, we have a proven record of successfully productizing
this research. Our technology is protected by our strong patent
portfolio and trade secrets developed in deployments with our
extensive customer base. Our leading technologies start with our
fundamental laser technology and extend through design and
assembly. In particular, the following technologies are central
to our business:


 



Semiconductor Laser Design &
Manufacturing.
  We are a leading manufacturer and
designer of lasers for high speed fiber optic communications
such as 10Gbps and 40Gbps. In the development and manufacturing
of new lasers, we utilize accumulated knowledge in areas such as
semiconductor growth, semiconductor materials systems, quantum
well engineering, design for very precise wavelengths, and high
frequency performance. This knowledge enables performance
improvements such as miniaturization, wavelength control, wide
temperature, and high speed operation, and provides us with a
time and knowledge advantage over companies that source their
10Gbps and 40Gbps lasers from other companies.


 



Optical Semiconductor Materials.  Central to
our laser design and manufacturing is our experience and
research in materials, one of the most challenging aspects of
optical communications technology and a source of competitive
advantage. Our advances in optical semiconductor materials have
enabled us to develop new lasers that are more compact, offer
greater control of the light emitted and utilize less power to
operate. For example, our innovations in the use of aluminum in
semiconductor lasers are utilized in several of our new lasers
including our uncooled DFB laser and an EA-DFB laser which
integrates a modulator with the DFB laser on the same chip. The
use of aluminum gives these lasers increased temperature
tolerance, improved efficiency, faster response time and greater
wavelength stability, all while achieving or exceeding industry
reliability requirements. Our research continues on new
materials systems for use in developing new laser





6





Table of Contents






structures that provide further improvements in laser operating
temperature and efficiency. We also have developed novel
techniques for the use of the materials system InAlAs in the
construction of high performance avalanche photodiodes which is
central to performing the receive function.


 



Subassembly Design.  Laser diodes and
photodetectors are particularly sensitive to external forces,
fields and chemical environments, so they are typically housed
in a hermetically sealed package. These laser diodes and
photodetectors are placed upon special ceramic circuit boards
and are packaged into a mechanical housing with certain
electronics into transmit or receive optical subassemblies, or
TOSA and ROSA, respectively. We have experts dedicated to TOSA
and ROSA design with fundamental knowledge in laser physics,
high frequency design and mechanical design who have garnered
numerous patents. We are a founding member of the XMD and XLMD
MSA’s which create a platform of miniature, high
performance TOSAs and ROSAs for 10Gbps and 40Gbps that can be
used across multiple products and sold to external customers.


 



Module Design.  Transceiver modules integrate
the TOSA, ROSA, integrated circuits and other components into
compact packages specified by various MSAs. We possess key
technology in the form of high speed circuit design skills for
error-free processing, transmitting, receiving and outputting of
information, exceptional mechanical design to allow for higher
tolerance of electrical and mechanical shock, and excellent
thermal design to transfer heat away from key components and out
of the module. We also have expertise in the design and
manufacture of optical modules for long distance transmission
including tunable laser modules. Long-distance transmission
modules require special manipulation of the optical signal to
insure that error free transmission is achieved over tens to
hundreds of kilometers of optical fiber.


 



Our research and development plans are driven by customer input
obtained by our sales and marketing teams and in our
participation in various MSAs, and by our long-term technology
and product strategies. We review research and development
priorities on a regular basis and advise key customers of our
progress to achieve better alignment in our product and
technology planning. For new components and more complex
modules, research and development is conducted in close
collaboration with our manufacturing operations to shorten the
time to market and optimize the manufacturing process. We
generally perform product commercialization activities ourselves
and utilize our Hitachi relationship to jointly develop or fund
more fundamental optical technology such as new laser designs
and materials systems.


 




This excerpt taken from the OPXT 10-K filed Jun 22, 2007.
Technology and Research and Development
 
We utilize our proprietary technology at many levels within our product development, ranging from the basic materials research that created the innovative materials we use in our lasers to the sophisticated component integration and optimization techniques we use to design our modules. We are committed to conducting fundamental research in laser technologies. In addition, we have a proven record of successfully productizing this research. Our technology is protected by our strong patent portfolio and trade secrets developed in deployments with our extensive customer base. Our leading technologies start with our fundamental laser technology and extend through design and assembly. In particular, the following technologies are central to our business:
 
Semiconductor Laser Design & Manufacturing.  We are a leading manufacturer and designer of lasers for high speed fiber optic communications such as 10Gbps and 40Gbps. In the development and manufacturing of new lasers, we utilize accumulated knowledge in areas such as semiconductor growth, semiconductor materials systems, quantum well engineering, design for very precise wavelengths, and high frequency performance. This knowledge enables performance improvements such as miniaturization, wavelength


7


Table of Contents

control, wide temperature, and high speed operation, and provides us with a time and knowledge advantage over companies that source their 10Gbps lasers from other companies.
 
Optical Semiconductor Materials.  Central to our laser design and manufacturing is our experience and research in materials, one of the most challenging aspects of optical communications technology and a source of competitive advantage. Our advances in optical semiconductor materials have enabled us to develop new lasers that are more compact, offer greater control of the light emitted and utilize less power to operate. For example, our innovations in the use of aluminum in semiconductor lasers are utilized in several of our newest lasers including our uncooled DFB laser and an EA-DFB laser which integrates a modulator with the DFB laser on the same chip. The use of aluminum gives these lasers increased temperature tolerance, improved efficiency, faster response time and greater wavelength stability, all while achieving or exceeding industry reliability requirements. Our research continues on new materials systems such as GaInNAs which we are developing for use in long wavelength VCSELs and further improvements in laser operating temperature and efficiency. We also have developed novel techniques for the use of the materials system InAlAs in the construction of high performance avalanche photodiodes which is central to performing the receive function.
 
Subassembly Design.  Laser diodes and photodetectors are particularly sensitive to external forces, fields and chemical environments, so they are typically housed in a hermetically sealed package. These laser diodes and photodetectors are placed upon special ceramic circuit boards and are packaged into a mechanical housing with certain electronics into transmit or receive optical subassemblies, or TOSA and ROSA, respectively. We have experts dedicated to TOSA and ROSA design with fundamental knowledge in laser physics, high frequency design and mechanical design who have garnered numerous patents. We are a founding member of the XMD MSA which creates a platform of miniature, high performance TOSAs and ROSAs for 10Gbps that can be used across multiple products and sold to external customers.
 
Module Design.  Transceiver modules integrate the TOSA, ROSA, integrated circuits and other components into compact packages specified by various MSAs. We possess key technology in the form of high speed circuit design skills for error-free processing, transmitting, receiving and outputting of information, exceptional mechanical design to allow for higher tolerance of electrical and mechanical shock, and excellent thermal design to transfer heat away from key components and out of the module. We also have expertise in the design and manufacture of optical modules for long distance transmission including tunable laser modules. Long-distance transmission modules require special manipulation of the optical signal to insure that error free transmission is achieved over tens to hundreds of kilometers of optical fiber.
 
Our research and development plans are driven by customer input obtained by our sales and marketing teams, in our participation in various MSAs, and our long-term technology and product strategies. We review research and development priorities on a regular basis and advise key customers of our progress to achieve better alignment in our product and technology planning. For new components and more complex modules, research and development is conducted in close collaboration with our manufacturing operations to shorten the time to market and optimize the manufacturing process. We generally perform product commercialization activities ourselves and utilize our Hitachi relationship to jointly develop or fund more fundamental optical technology such as new laser designs and materials systems.
 

"Technology and Research and Development" elsewhere:

Omniture (OMTR)
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