RTEC » Topics » General

This excerpt taken from the RTEC DEF 14A filed Apr 17, 2009.
General
 
The enclosed Proxy is solicited on behalf of the Board of Directors of Rudolph Technologies, Inc. (the “Company”) for use at the 2009 Annual Meeting of Stockholders to be held May 19, 2009 at 10:00 a.m., local time (the “Annual Meeting”), or at any adjournment thereof, for the purposes set forth herein and in the accompanying Notice of Annual Meeting of Stockholders. The Annual Meeting will be held at the Company’s corporate headquarters, located at One Rudolph Road, Flanders, New Jersey, 07836. The Company’s telephone number is (973) 691-1300.
 
These proxy solicitation materials and the Company’s Annual Report to Stockholders for the year ended December 31, 2008, including financial statements, were mailed on or about April 17, 2009 to stockholders entitled to vote at the meeting.
 
These excerpts taken from the RTEC 10-K filed Mar 6, 2009.
General
 
Rudolph Technologies, Inc. is a worldwide leader in the design, development, and manufacture of high-performance process control metrology, defect inspection, and data analysis systems used by semiconductor device manufacturers. We provide yield management solutions used in both wafer processing and final manufacturing through a family of standalone systems and integrated modules for both transparent and opaque thin film measurements and macro-defect inspection. All of these systems feature sophisticated software and production-worthy automation. Rudolph systems are backed by worldwide customer service and applications support.
 
The purchase of intellectual property and selected assets from RVSI Inspection LLC was announced on January 22, 2008. As a result, the Wafer Scannertm (WS) 3800 inspection system was added to the Rudolph product portfolio. The WS Series is used by many back-end manufacturers, with the highest volume found in bump applications. The new WS3840tm was launched in May and delivered to a major Asian semiconductor foundry.
 
Metrology Systems. The industry’s first production-oriented microprocessor-controlled ellipsometer for thin transparent film measurements was introduced by Rudolph in 1977. Since that time, we have consistently provided innovative product developments designed to meet manufacturers’ most advanced measurement requirements. Our patented transparent film technology uses up to four lasers operating simultaneously at multiple angles and multiple wavelengths, providing powerful analysis and measurement capabilities to handle the most challenging requirements of today’s advanced processes and tomorrow’s new materials. Unlike the white-light sources used in spectroscopic ellipsometers, laser light sources make our metrology tools inherently stable, increase measurement speed and accuracy, and reduce maintenance costs by minimizing the time required to re-qualify a light source when


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it is replaced. Our systems also employ a proprietary reflectometer technology that allows the characterization of films and film stacks that cannot be performed using conventional reflectometry or ellipsometry alone.
 
For opaque film characterization, we brought patented optical acoustic metal film metrology technology to the semiconductor manufacturing floor that allows customers to simultaneously measure the thickness and other properties of up to six metal or other opaque film layers in a non-contact manner on product wafers. PULSEtm Technology uses an ultra-fast laser to generate sound waves that pass down through a stack of opaque films such as those used in copper or aluminum interconnect processes, sending back to the surface an echo that indicates film thickness, density, and other process critical parameters. We believe we are a leader in providing systems that can non-destructively measure opaque thin-film stacks with the speed and accuracy semiconductor device manufacturers demand in order to achieve high yields with the latest fabrication processes. The technology is ideal for characterizing copper interconnect structures and the majority of all systems sold have been for copper applications.
 
Inspection Systems. Chip manufacturers deploy advanced macro-defect inspection (defects greater in size than 0.5 micron) throughout the fab to monitor key process steps, gather process-enhancing information and ultimately, lower manufacturing costs. Field-established tools such as the AXitm and NSX® are found in wafer processing (front-end) and final manufacturing (back-end) facilities around the world. These high-speed tools incorporate features such as waferless recipe creation, tool-to-tool correlation, multiple inspection resolutions and proprietary review and classification software that are required in today’s high-volume integrated circuit (IC) manufacturing environments. In addition to wafer frontside inspection, Rudolph’s innovative Explorer® Cluster incorporates wafer edge and backside inspection in one integrated platform to enhance productivity and continuously improve fab yield.
 
Data Analysis & Review Systems. Rudolph has a comprehensive offering of software solutions for process management and data review. Using wafer maps, charts and graphs, the vast amount of data gathered through automated inspection can be analyzed to determine trends that ultimately affect yield. Our goal is to provide our customers with timely and accurate information so that corrective actions can be taken. Software solutions available to our customers include products that identify, classify and analyze defect data as well as fabwide systems that are designed to determine the root cause of yield excursions as early as possible in the production flow.
 
General


 



Rudolph Technologies, Inc. is a worldwide leader in the design,
development, and manufacture of high-performance process control
metrology, defect inspection, and data analysis systems used by
semiconductor device manufacturers. We provide yield management
solutions used in both wafer processing and final manufacturing
through a family of standalone systems and integrated modules
for both transparent and opaque thin film measurements and
macro-defect inspection. All of these systems feature
sophisticated software and production-worthy automation. Rudolph
systems are backed by worldwide customer service and
applications support.


 



The purchase of intellectual property and selected assets from
RVSI Inspection LLC was announced on January 22, 2008. As a
result, the Wafer
Scannertm

(WS) 3800 inspection system was added to the Rudolph product
portfolio. The WS Series is used by many back-end manufacturers,
with the highest volume found in bump applications. The new
WS3840tm

was launched in May and delivered to a major Asian semiconductor
foundry.


 



Metrology Systems. The industry’s first
production-oriented microprocessor-controlled ellipsometer for
thin transparent film measurements was introduced by Rudolph in
1977. Since that time, we have consistently provided innovative
product developments designed to meet manufacturers’ most
advanced measurement requirements. Our patented transparent film
technology uses up to four lasers operating simultaneously at
multiple angles and multiple wavelengths, providing powerful
analysis and measurement capabilities to handle the most
challenging requirements of today’s advanced processes and
tomorrow’s new materials. Unlike the white-light sources
used in spectroscopic ellipsometers, laser light sources make
our metrology tools inherently stable, increase measurement
speed and accuracy, and reduce maintenance costs by minimizing
the time required to re-qualify a light source when





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it is replaced. Our systems also employ a proprietary
reflectometer technology that allows the characterization of
films and film stacks that cannot be performed using
conventional reflectometry or ellipsometry alone.


 



For opaque film characterization, we brought patented optical
acoustic metal film metrology technology to the semiconductor
manufacturing floor that allows customers to simultaneously
measure the thickness and other properties of up to six metal or
other opaque film layers in a non-contact manner on product
wafers.
PULSEtm

Technology uses an ultra-fast laser to generate sound waves that
pass down through a stack of opaque films such as those used in
copper or aluminum interconnect processes, sending back to the
surface an echo that indicates film thickness, density, and
other process critical parameters. We believe we are a leader in
providing systems that can non-destructively measure opaque
thin-film stacks with the speed and accuracy semiconductor
device manufacturers demand in order to achieve high yields with
the latest fabrication processes. The technology is ideal for
characterizing copper interconnect structures and the majority
of all systems sold have been for copper applications.


 



Inspection Systems. Chip manufacturers deploy
advanced macro-defect inspection (defects greater in size than
0.5 micron) throughout the fab to monitor key process steps,
gather process-enhancing information and ultimately, lower
manufacturing costs. Field-established tools such as the
AXitm

and
NSX®

are found in wafer processing (front-end) and final
manufacturing (back-end) facilities around the world. These
high-speed tools incorporate features such as waferless recipe
creation, tool-to-tool correlation, multiple inspection
resolutions and proprietary review and classification software
that are required in today’s high-volume integrated circuit
(IC) manufacturing environments. In addition to wafer
frontside inspection, Rudolph’s innovative
Explorer®

Cluster incorporates wafer edge and backside inspection in one
integrated platform to enhance productivity and continuously
improve fab yield.


 



Data Analysis & Review Systems. Rudolph
has a comprehensive offering of software solutions for process
management and data review. Using wafer maps, charts and graphs,
the vast amount of data gathered through automated inspection
can be analyzed to determine trends that ultimately affect
yield. Our goal is to provide our customers with timely and
accurate information so that corrective actions can be taken.
Software solutions available to our customers include products
that identify, classify and analyze defect data as well as
fabwide systems that are designed to determine the root cause of
yield excursions as early as possible in the production flow.


 




This excerpt taken from the RTEC DEF 14A filed Apr 16, 2008.

General

The enclosed Proxy is solicited on behalf of the Board of Directors of Rudolph Technologies, Inc. (the “Company”) for use at the 2008 Annual Meeting of Stockholders to be held May 20, 2008 at 9:00 a.m., local time (the “Annual Meeting”), or at any adjournment thereof, for the purposes set forth herein and in the accompanying Notice of Annual Meeting of Stockholders. The Annual Meeting will be held at the Company’s corporate headquarters, located at One Rudolph Road, Flanders, New Jersey, 07836. The Company’s telephone number is (973) 691-1300.

These proxy solicitation materials and the Company’s Annual Report to Stockholders for the year ended December 31, 2007, including financial statements, were mailed on or about April 21, 2008 to stockholders entitled to vote at the meeting.

This excerpt taken from the RTEC 10-K filed Mar 3, 2008.

General

 

Rudolph Technologies, Inc. is a worldwide leader in the design, development, manufacture and support of high-performance process control metrology, defect inspection, and data analysis systems used by semiconductor device manufacturers. We provide yield management solutions used in both wafer processing and final manufacturing through a family of standalone systems and integrated modules for both transparent and opaque thin film measurements and macro-defect inspection. All of these systems feature production-worthy automation and are backed by worldwide customer support.

 

Our acquisition of the net assets of Applied Precision’s semiconductor division to be known as the Rudolph Technologies Probe Card Test and Analysis division (“PCTA”) was completed on December 18, 2007. As a result, we expanded our offerings of inspection systems to include probe card test and analysis products. For our customers in semiconductor packaging and test, these products enable process validation, process verification and process improvement within probe and wafer test segments.

 

Metrology Systems. The industry’s first production-oriented microprocessor-controlled ellipsometer for thin transparent film measurements was introduced by Rudolph in 1977. Since that time, we have consistently provided innovative product developments designed to meet manufacturers’ most advanced measurement requirements. Our patented transparent film technology uses up to four lasers operating simultaneously at multiple angles and multiple wavelengths, providing powerful analysis and measurement capabilities to handle

 

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the most challenging requirements of today’s advanced processes and tomorrow’s new materials. Unlike the white-light sources used in spectroscopic ellipsometers, laser light sources make our metrology tools inherently stable, increase measurement speed and accuracy, and reduce maintenance costs by minimizing the time required to re-qualify a light source when it is replaced. Our systems also employ a proprietary reflectometer technology that allows the characterization of films and film stacks that cannot be performed using conventional reflectometry or ellipsometry alone.

 

In November 2007 Rudolph announced it had granted Entrepix, Inc., an exclusive license to manufacture, sell, service and support the Rudolph AutoEL® series of thin-film ellipsometers. Thousands of AutoEL tools have been placed in universities, semiconductor research labs and semiconductor production facilities since it was commercialized in 1977, with many of those tools still in use today.

 

For opaque film characterization, we brought patented optical acoustic metal film metrology technology to the semiconductor manufacturing floor that allows customers to simultaneously measure the thickness and other properties of up to six metal or other opaque film layers in a non-contact manner on product wafers. PULSE Technology uses an ultra-fast laser to generate sound waves that pass down through a stack of opaque films such as those used in copper or aluminum interconnect processes, sending back to the surface an echo that indicates film thickness, density, and other process critical parameters. We believe we are a leader in providing systems that can non-destructively measure opaque thin-film stacks with the speed and accuracy semiconductor device manufacturers demand in order to achieve high yields with the latest fabrication processes. The technology is ideal for characterizing copper interconnect structures and the majority of all systems sold have been for copper applications.

 

Inspection Systems. Chip manufacturers deploy advanced macro-defect inspection (defects greater in size than 0.5 micron) throughout the fab to monitor key process steps, gather process-enhancing information and ultimately, lower manufacturing costs. Field-established tools such as the NSX®, AXi, and WaferView® are found in wafer processing (front-end) and final manufacturing (back-end) facilities around the world. These high-speed tools incorporate features such as waferless recipe creation, tool-to-tool correlation, multiple inspection resolutions and proprietary review and classification software that are required in today’s high-volume integrated circuit (IC) manufacturing environments. In addition to wafer frontside inspection, Rudolph’s innovative Explorer Cluster incorporates wafer edge and backside inspection in one integrated platform to enhance productivity and continuously improve fab yield.

 

Data Analysis & Review Systems. Rudolph has a comprehensive offering of software solutions for process management and data review. Using wafer maps, charts and graphs, the vast amount of data gathered through automated inspection can be analyzed to determine trends that ultimately affect yield. Our goal is to provide our customers with timely and accurate information so that corrective actions can be taken. Software solutions available to our customers include products that identify, classify and analyze defect data as well as fabwide systems that are designed to determine the root cause of yield excursions as early as possible in the production flow.

 

This excerpt taken from the RTEC 8-K filed Aug 1, 2007.

(iv)              General

        No person shall be eligible for election as a director of the corporation unless nominated in accordance with the procedures set forth in this Section 2.5, and only such business shall be conducted at a meeting of stockholders as shall have been brought before the meeting in accordance with the procedures set forth in this Section 2.5.  The chairman of the meeting shall, if the facts warrant, determine and declare at the meeting that a nomination was not made, or that business was not properly brought before the meeting, in accordance with the procedures prescribed by these bylaws, and if he should so determine, he shall so declare at the meeting and the defective nomination or any such business not properly brought before the meeting shall be disregarded.  Notwithstanding the foregoing provisions of this Section 2.5, unless otherwise required by law, if the stockholder (or a qualified representative of the stockholder) does not appear at the annual or special meeting of stockholders of the corporation to present a nomination or proposed business, such nomination shall be disregarded and such proposed business shall not be transacted, notwithstanding that proxies in respect of such vote may have been received by the corporation.  For purposes of this Section 2.5, to be considered a qualified representative of the stockholder, a person must be a duly authorized officer, manager or partner of such stockholder or must be authorized by a writing executed by such stockholder or an electronic transmission delivered by such stockholder to act for such stockholder as proxy at the meeting of stockholders and such person must produce such writing or electronic transmission, or a reliable reproduction of the writing or electronic transmission, at the meeting of stockholders.

        For purposes of this Section 2.5, "public announcement" shall include disclosure in a press release reported by the Dow Jones News Service, Associated Press or comparable national news service or in a document publicly filed by the Corporation with the Securities and Exchange Commission pursuant to Section 13, 14 or 15(d) of the Securities and Exchange Act of 1934, as amended (the "Exchange Act").

        Notwithstanding the foregoing provisions of this Section 2.5, a stockholder shall also comply with all applicable requirements of the Exchange Act and the rules and regulations thereunder with respect to the matters set forth in this Section 2.5.  Nothing in this Section 2.5 shall be deemed to affect any rights (a) of stockholders to request inclusion of proposals or nominations in the corporation's proxy statement pursuant to applicable rules or regulations promulgated under the Exchange Act or (b) of the holders of any series of preferred stock to elect directors pursuant to any applicable provisions of the certificate of incorporation.

This excerpt taken from the RTEC DEF 14A filed Apr 20, 2007.

General

The enclosed Proxy is solicited on behalf of the Board of Directors of Rudolph Technologies, Inc. (the “Company”) for use at the 2007 Annual Meeting of Stockholders to be held May 24, 2007 at 9:00 a.m., local time (the “Annual Meeting”), or at any adjournment thereof, for the purposes set forth herein and in the accompanying Notice of Annual Meeting of Stockholders. The Annual Meeting will be held at the Company’s metrology business unit facility, located in Mount Olive Township at 550 Clark Drive, Budd Lake, New Jersey, 07828. The Company’s telephone number is (973) 691-1300.

These proxy solicitation materials and the Company’s Annual Report to Stockholders for the year ended December 31, 2006, including financial statements, were mailed on or about April 20, 2007 to stockholders entitled to vote at the meeting.

This excerpt taken from the RTEC 10-K filed Feb 23, 2007.

General

 

Rudolph Technologies, Inc. is a worldwide leader in the design, development, manufacture and support of high-performance process control metrology, defect inspection, and data analysis systems used by semiconductor device manufacturers. We provide yield management solutions used in both wafer processing and final manufacturing through a family of standalone systems and integrated modules for both transparent and opaque thin film measurements and macro-defect inspection. All of these systems feature production-worthy automation and are backed by worldwide customer support.

 

Our merger with August Technology was completed on February 15, 2006. As a result, we expanded our automated defect detection and product characterization systems portfolio to include new capabilities in machine vision technology, optics, lighting and precision motion control as well as proprietary software and applications experience. These systems provide our customers with information that enables process-enhancing decisions which can ultimately lower manufacturing costs, improve time-to market and enhance the performance of their products

 

Metrology Systems. The industry’s first production-oriented microprocessor-controlled ellipsometer for thin transparent film measurements was introduced by Rudolph in 1977. Since that time, we have consistently provided innovative product developments designed to meet manufacturers’ most advanced measurement requirements. Our patented transparent film technology uses up to four lasers operating simultaneously at

 

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multiple angles and multiple wavelengths, providing powerful analysis and measurement capabilities to handle the most challenging requirements of today’s advanced processes and tomorrow’s new materials. Unlike the white-light sources used in spectroscopic ellipsometers, laser light sources make our metrology tools inherently stable, increase measurement speed and accuracy, and reduce maintenance costs by minimizing the time required to re-qualify a light source when it is replaced. Our systems also employ a proprietary reflectometer technology that allows the characterization of films and film stacks that cannot be performed using conventional reflectometry or ellipsometry alone.

 

For opaque film characterization, we brought patented optical acoustic metal film metrology technology to the semiconductor manufacturing floor that allows customers to simultaneously measure the thickness and other properties of up to six metal or other opaque film layers in a non-contact manner on product wafers. PULSE Technology uses an ultra-fast laser to generate sound waves that pass down through a stack of opaque films such as those used in copper or aluminum interconnect processes, sending back to the surface an echo that indicates film thickness, density, and other process critical parameters. We believe we are a leader in providing systems that can non-destructively measure opaque thin-film stacks with the speed and accuracy semiconductor device manufacturers demand in order to achieve high yields with the latest fabrication processes. The technology is ideal for characterizing copper interconnect structures and the majority of all systems sold have been for copper applications.

 

Inspection Systems. Chip manufacturers deploy advanced macro defect inspection (defects greater in size than 0.5 micron) throughout the fab to monitor key process steps, gather process-enhancing information and ultimately, lower manufacturing costs. Field-established tools such as the NSX, AXi, WaferView and 3Di systems are found in wafer processing (front-end) and final manufacturing (back-end) facilities around the world. These high-speed tools incorporate features like waferless recipe creating, tool-to-tool correlation, multiple inspection resolutions and proprietary review and classification software that are required in today’s high-volume IC manufacturing environments. In addition to wafer frontside inspection, Rudolph’s innovative all-surface systems incorporate wafer edge and backside inspection in one integrated platform to enhance productivity and continuously improve fab yield.

 

Data Analysis & Review Systems. Rudolph has a comprehensive offering of software solutions for process management and data review. Using wafer maps, charts and graphs, the vast amount of data gathered through automated inspection can be analyzed to determine trends that ultimately affect yield. Our goal is to provide our customers with timely and accurate information so that corrective actions can be taken. Software solutions available to our customers include products that identify, classify and analyze defect data as well as fabwide systems that are designed to determine the root cause of yield excursions as early as possible in the production flow.

 

This excerpt taken from the RTEC DEF 14A filed Apr 21, 2006.

General

The enclosed Proxy is solicited on behalf of the Board of Directors of Rudolph Technologies, Inc. (the “Company”) for use at the 2006 Annual Meeting of Stockholders to be held May 23, 2006 at 10:00 a.m., local time (the “Annual Meeting”), or at any adjournment thereof, for the purposes set forth herein and in the accompanying Notice of Annual Meeting of Stockholders. The Annual Meeting will be held at the Company’s metrology business unit facility, located in Mount Olive Township at 550 Clark Drive, Budd Lake, New Jersey, 07828. The Company’s telephone number is (973) 691-1300.

These proxy solicitation materials and the Company’s Annual Report to Stockholders for the year ended December 31, 2005, including financial statements, were mailed on or about April 21, 2006 to stockholders entitled to vote at the meeting.

This excerpt taken from the RTEC 10-K filed Mar 16, 2006.

General

 

Rudolph Technologies, Inc. is a worldwide leader in the design, development and manufacture of high-performance process control metrology and defect inspection systems used by semiconductor device manufacturers. We provide full-fab solutions through a family of standalone systems and integrated modules for both transparent and opaque thin film measurements, and macro-defect inspection. All these systems, which have production-worthy automation, are designed specifically for semiconductor manufacturing applications and are backed by worldwide customer support.

 

On February 15, 2006, we completed the merger with August Technology Corporation, a world-class provider of automated defect detection and product characterization systems for microelectronic device manufacturers. August Technology systems provide these manufacturers with information that enables process-enhancing decisions, ultimately lowering manufacturing costs, improving time-to market and enhancing the performance of their products. August Technology combines its core competencies in machine vision technology, optics, lighting and precision motion control with its proprietary software and extensive microelectronic-specific applications experience to deliver scalable, modular systems that excel at the automated detection of advanced macro defects, which is defined to be defects greater in size than 0.5 micron. Through the merger with August Technology, we have gained an increased fab presence for our new products aimed at the emerging high-growth front-end macro defect inspection market. The information included in this Form 10-K reflects Rudolph prior to the completion of this merger.

 

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We introduced the industry’s first production-oriented microprocessor-controlled ellipsometer for thin transparent film measurements in 1977. Since that time, we have consistently provided innovative product developments designed to meet manufacturers’ most advanced measurement requirements. Our patented transparent film technology uses up to four lasers operating simultaneously at multiple angles and multiple wavelengths, providing powerful analysis and measurement capabilities to handle the most challenging requirements of today’s advanced processes and tomorrow’s new materials. Unlike the white-light sources used in spectroscopic ellipsometers, lasers light sources make our metrology tools inherently stable, increase measurement speed and accuracy, and reduce maintenance costs by minimizing the time required to requalify a light source when it is replaced. Our systems also employ a proprietary reflectometer technology that allows the characterization of films and film stacks that cannot be performed using conventional reflectometry or ellipsometry alone. Our fifth generation offering, the S300 ultra-II, is designed to deliver high precision accuracy when optimizing critical film deposition processes and superior repeatability when monitoring production of current and future generations of advanced materials, including nitrided and high-k gate materials, low-k dielectrics, low-k dielectric integration materials, 193 nm ARCs, and SiGe. In 2005, the transparent line was extended to include the ultra-II CD. This new system measures critical dimensions—which are key to advanced lithography and etch processes—simultaneously with film thickness and optical properties. Combining both measurements in a single tool without sacrificing industry-leading performance, can allow the ultra-II CD to save manufacturers time, money and fab space.

 

For opaque film characterization, we brought patented optical acoustic metal film metrology technology to the semiconductor manufacturing floor with MetaPULSE®. MetaPULSE allows customers to simultaneously measure the thickness and other properties of up to six metal or other opaque film layers in a non-contact manner on product wafers. PULSE Technology uses an ultra-fast laser to generate sound waves that pass down through a stack of opaque films such as those used in copper or aluminum interconnect processes, sending back to the surface an echo that indicates film thickness, density, and other process critical parameters. We believe we are a leader in providing systems that can non-destructively measure opaque thin-film stacks with the speed and accuracy semiconductor device manufacturers demand in order to achieve high yields with the latest fabrication processes. The technology is ideal for characterizing copper interconnect structures and over two-thirds of all systems sold have been for copper applications. In 2001, the MetaPULSE-II, our second generation metal metrology system, was introduced, providing for superior performance on narrow lines and more complex structures, while enabling high throughput, a smaller measurement spot, and excellent repeatability. This year marked the introduction of the MetaPULSE-III, specifically designed for ultra-thin films and advanced manufacturing processes at the 45 nm technology node. This system incorporates mix and match metrology options to address increased process complexity while additionally offering manufacturers a low cost of ownership.

 

Our acquisition of the Yield Metrology Group (YMG), in September 2002, marked the introduction of the WaferView® family of metrology systems for automated macro-defect inspection of lithography, etch, CMP, and bump processes. The advanced color vision system provides higher defect detection rates than can be achieved with gray-scale systems and our proprietary and patented knowledge-based algorithms accurately and consistently classify macro-defects which vary widely in color, shape, size, and appearance. Results from WaferView’s expert system software can be integrated directly into the manufacturer’s process control system to provide rapid notification of process problems. In 2004, a new line of WaferView products, the 220 and 320 Series, was introduced. These systems offer higher resolution inspection while maintaining production throughputs, add the ability to inspect the edge and back of the wafer to capture more defects and to improve root-cause analysis, and incorporate the high-resolution ReviewScope microscope for sub-micron defect inspection and fast review.

 

The WaferView 220 and 320 are part of the WaferView Team, which was also introduced in 2004. The Team provides the industry’s first cost-effective inline real-time macro-defect inspection for every wafer at every critical process step. The Team consists of three members:

 

   

The i-MOD ADI inspection module is designed for integration directly into lithography track equipment. Lithography inspection is critical to high-yield semiconductor manufacturing as detected

 

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defects can be reworked and corrected. With the i-MOD ADI, manufacturers can inspect the surface of every wafer immediately after processing without impacting track performance or throughput.

 

    Standalone WaferView systems offer a modular configuration, allowing manufacturers to customize a tool to meet their specific inspection needs for lithography, etch, CMP, or bump processes. The standalone tools offer industry leading inspection capabilities and also support the i-MOD ADI with high-magnification review of suspect wafers and the ability to inspect the wafer’s edge and back.

 

    The YieldView® server, a fab-wide information system, coordinates the Team. YieldView stores, manages, and analyzes macro and microdefect data and inspection recipes from inspection systems throughout the fab to rapidly pinpoint the source of process excursions and to make fast and accurate pass/rework/scrap decisions.

 

The Team offers virtually instantaneous notification of process problems and simplifies root-cause analysis, minimizing the number of misprocessed wafers by substantially reducing delays between defect formation and corrective action. The Team can also significantly lower personnel costs, contributing to a very short payback on investment.

 

This excerpt taken from the RTEC DEF 14A filed Apr 22, 2005.

General

 

The enclosed Proxy is solicited on behalf of the Board of Directors of Rudolph Technologies, Inc. (the “Company”) for use at the 2005 Annual Meeting of Stockholders to be held May 24, 2005 at 10:00 a.m., local time (the “Annual Meeting”), or at any adjournment thereof, for the purposes set forth herein and in the accompanying Notice of Annual Meeting of Stockholders. The Annual Meeting will be held at the Company’s principal executive offices, located at One Rudolph Road, Flanders, New Jersey, 07836. The Company’s telephone number is (973) 691-1300.

 

These proxy solicitation materials and the Company’s Annual Report to Stockholders for the year ended December 31, 2004, including financial statements, were mailed on or about April 25, 2005 to stockholders entitled to vote at the meeting.

 

This excerpt taken from the RTEC 10-K filed Mar 15, 2005.

General

 

Rudolph is a worldwide leader in the design, development and manufacture of high-performance process control metrology and defect inspection systems used by semiconductor device manufacturers. We provide full-fab solutions through a family of standalone systems and integrated modules for both transparent and opaque thin film measurements, and macro-defect inspection. These systems, which have production-worthy automation, are designed specifically for semiconductor manufacturing applications and are backed by worldwide customer support.

 

We introduced the industry’s first production-oriented microprocessor-controlled ellipsometer for thin transparent film measurements in 1977. Since that time, we have consistently provided innovative product developments designed to meet manufacturers’ most advanced measurement requirements. Our patented transparent film technology uses up to four lasers operating simultaneously at multiple angles and multiple wavelengths, providing powerful analysis and measurement capabilities to handle the most challenging requirements of today’s advanced processes and tomorrow’s new materials. Unlike spectroscopic ellipsometers, lasers make our metrology tools inherently stable, increase measurement speed and accuracy, and reduce maintenance costs by minimizing the time required to requalify a light source when it is replaced. Our systems also employ a proprietary reflectometer technology that allows the characterization of films and film stacks that

 

1


Table of Contents

cannot be performed using conventional reflectometry or ellipsometry alone. Our latest offering, the S300 ultra-II, delivers high precision accuracy when optimizing critical film deposition processes and superior repeatability when monitoring production of current and future generations of advanced materials, including nitrided and high-k gate materials, low-k dielectrics, low-k dielectric integration materials, 193 nm ARCs, and SiGe.

 

For opaque film characterization, we brought patented optical acoustic metal film metrology technology to the semiconductor manufacturing floor with MetaPULSE®. MetaPULSE allows customers to simultaneously measure the thickness and other properties of up to six metal or other opaque film layers in a non-contact manner on product wafers. PULSE Technology uses an ultra-fast laser to generate sound waves that pass down through a stack of metal or opaque films such as those used in copper or aluminum interconnect processes, sending back to the surface an echo that indicates film thickness, density, and other process critical parameters. We believe we are a leader in providing systems that can non-destructively measure opaque thin-film stacks with the speed and accuracy semiconductor device manufacturers demand in order to achieve high yields with the latest fabrication processes. The technology is ideal for characterizing copper interconnect structures and over two-thirds of all systems sold have been for copper applications. The MetaPULSE-II is our second generation metal metrology system which provides superior performance on today’s ultra thin barriers, narrow lines, and more complex structures, while providing high throughput, a smaller measurement spot, and excellent repeatability.

 

Our acquisition of the Yield Metrology Group (YMG), in September 2002, marked the introduction of the WaferView® family of metrology systems for automated macro-defect inspection of lithography, etch, CMP, and bump processes. The advanced color vision system provides higher defect detection rates than can be achieved with gray-scale systems and our proprietary and patented knowledge-based algorithms accurately and consistently classify macro-defects which vary widely in color, shape, size, and appearance. Results from WaferView’s expert system software can be integrated directly into the manufacturer’s process control system to provide rapid notification of process problems. In 2004, a new line of WaferView products, the 220 and 320 Series, was introduced. The new systems offer higher resolution inspection while maintaining production throughputs, add the ability to inspect the edge and back of the wafer to capture more defects and to improve root-cause analysis, and incorporate the high-resolution ReviewScope microscope for sub-micron defect inspection and fast review.

 

The new WaferView products are part of the WaferView Team, which was also introduced in 2004. The Team provides the industry’s first cost-effective inline real-time macro-defect inspection for every wafer at every critical process step. The Team consists of three members:

 

    The i-MOD ADI inspection module is designed for integration directly into lithography track equipment. Lithography inspection is critical to high-yield semiconductor manufacturing as detected defects can be reworked and corrected. With the i-MOD ADI, manufacturers can inspect the surface of every wafer immediately after processing without impacting track performance or throughput.

 

    Standalone WaferView systems offer a modular configuration, allowing manufacturers to customize a tool to meet their specific inspection needs for lithography, etch, CMP, or bump processes. The standalone tools offer industry leading inspection capabilities and also support the i-MOD ADI with high-magnification review of suspect wafers and the ability to inspect the wafer’s edge and back.

 

    The YieldView® server, a fab-wide information system, coordinates the Team. YieldView stores, manages, and analyzes macro and microdefect data and inspection recipes from inspection systems throughout the fab to rapidly pinpoint the source of process excursions and to make fast and accurate pass/rework/scrap decisions.

 

The Team offers virtually instantaneous notification of process problems and simplifies root-cause analysis, minimizing the number of misprocessed wafers by substantially reducing delays between defect formation and corrective action. The Team can also significantly lower personnel costs, contributing to a very short payback on investment.

 

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