Teijin Chemicals Ltd., Asia's leading polycarbonate resin manufacturer, announced today that it will participate in Chinaplas 2012, Asia's largest international exhibition in the plastics and rubber industries, which will be held at the Shanghai New International Expo Centre in Shanghai from April 18 to 21. Teijin Chemicals' 13th appearance at the fair will promote its ongoing expansion in China, a top-priority market for the company.
Teijin Chemicals' exhibit (stand H41, hall N1) will feature a lightweight EV concept car named CONCH, which includes components made of advanced materials from Teijin Group companies, such as Panlite® polycarbonate resin as a substitute for window glass, Tenax® carbon fiber as a substitute for body metal and Biofront®, a highly heat-resistant bioplastic, for seat fabric. The concept car by Phiaro Corporation, Inc., a Japanese design company, embodies the vision of a futuristic, highly environmentally friendly electric vehicle.
The Teijin Chemicals exhibition will also present numerous solutions achieved with its advanced plastic materials, such as Panlite® polycarbonate resin and sheet, including weight reduction, energy savings, improved performance and enhanced safety in fields such as automotive, the environment, energy, information, electronics and health.
About the Teijin Group
Teijin (TOKYO:3401) is a technology-driven global group offering advanced solutions in the areas of sustainable transportation, information and electronics, safety and protection, environment and energy and healthcare. Its main fields of operation are high-performance fibers such as aramid, carbon fibers & composites, healthcare, films, resin & plastic processing, polyester fibers, products converting and IT. The group has some 150 companies and over 17,000 employees spread out over 20 countries worldwide. It posted consolidated sales of JPY 815.7 billion (USD 9.9 billion) and total assets of JPY 761.5 billion (USD9.3 billion) in the fiscal year ending March 31, 2011.
Please visit www.teijin.co.jp/english.